View BAS21_4659860.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

DISCRETE SEMICONDUCTORS
DATA SHEET
dbook, halfpage
M3D088
BAS19; BAS20; BAS21 General purpose diodes
Product data sheet Supersedes data of 1999 May 26 2003 Mar 20
NXP Semiconductors
Product data sheet
General purpose diodes
FEATURES * Small plastic SMD package * Switching speed: max. 50 ns * General application * Continuous reverse voltage: max. 100 V; 150 V; 200 V * Repetitive peak reverse voltage: max. 120 V; 200 V; 250 V * Repetitive peak forward current: max. 625 mA. APPLICATIONS * General purpose switching in e.g. surface mounted circuits. DESCRIPTION The BAS19, BAS20 and BAS21 are general purpose diodes fabricated in planar technology, and encapsulated in a small SOT23 plastic SMD package. PINNING PIN 1 2 3
BAS19; BAS20; BAS21
DESCRIPTION anode not connected cathode
handbook, halfpage 2
1 2 n.c. 3 3
MAM185
1
MARKING TYPE NUMBER BAS19 BAS20 BAS21 Note 1. = p: Made in Hong Kong. = t: Made in Malaysia. = W: Made in China. MARKING CODE (1) JP JR JS Fig.1 Simplified outline (SOT23) and symbol.
2003 Mar 20
2
NXP Semiconductors
Product data sheet
General purpose diodes
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VRRM BAS19 BAS20 BAS21 VR continuous reverse voltage BAS19 BAS20 BAS21 IF IFRM IFSM continuous forward current repetitive peak forward current non-repetitive peak forward current see Fig.2; note 1 PARAMETER repetitive peak reverse voltage CONDITIONS
BAS19; BAS20; BAS21
MIN. - - - - - - - -
MAX. 120 200 250 100 150 200 200 625 V V V V V V
UNIT
mA mA
square wave; Tj = 25 C prior to surge; see Fig.4 t = 1 s t = 100 s t = 10 ms - - - - -65 - 9 3 1.7 250 +150 150 A A A mW C C
Ptot Tstg Tj Note
total power dissipation storage temperature junction temperature
Tamb = 25 C; note 1
1. Device mounted on an FR4 printed-circuit board.
2003 Mar 20
3
NXP Semiconductors
Product data sheet
General purpose diodes
ELECTRICAL CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL VF PARAMETER forward voltage see Fig.3 IF = 100 mA IF = 200 mA IR reverse current BAS19 BAS20 BAS21 Cd trr diode capacitance reverse recovery time see Fig.5 VR = 100 V VR = 100 V; Tj = 150 C VR = 150 V VR = 150 V; Tj = 150 C VR = 200 V VR = 200 V; Tj = 150 C f = 1 MHz; VR = 0; see Fig.6 CONDITIONS
BAS19; BAS20; BAS21
MAX. 1 1.25 100 100 100 100 100 100 5 50 V V
UNIT
nA A nA A nA A pF ns
when switched from IF = 30 mA to IR = 30 mA; RL = 100 ; measured at IR = 3 mA; see Fig.8
THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a Note 1. Device mounted on an FR4 printed-circuit board. PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 CONDITIONS VALUE 330 500 UNIT K/W K/W
2003 Mar 20
4
NXP Semiconductors
Product data sheet
General purpose diodes
GRAPHICAL DATA
MBG442
BAS19; BAS20; BAS21
handbook, halfpage
300
handbook, halfpage
600
MBG384
IF (mA) 200
IF (mA)
(1) (2) (3)
400
100
200
0 0 100 Tamb (oC) 200
0
0
1
VF (V)
2
Device mounted on an FR4 printed-circuit board.
(1) Tj = 150 C; typical values. (2) Tj = 25 C; typical values. (3) Tj = 25 C; maximum values.
Fig.2
Maximum permissible continuous forward current as a function of ambient temperature.
Fig.3
Forward current as a function of forward voltage.
102 handbook, full pagewidth IFSM (A)
MBG703
10
1
10-1 1
Based on square wave currents. Tj = 25 C prior to surge.
10
102
103
tp (s)
104
Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.
2003 Mar 20
5
NXP Semiconductors
Product data sheet
General purpose diodes
BAS19; BAS20; BAS21
102 handbook, halfpage IR (A) 10
MBG381
handbook, halfpage
1.0
MBG447
Cd (pF) 0.8
1
(1)
(2)
0.6
10
1
0.4
10 2 0 100 Tj (oC) 200
0.2 0 2 4 6 VR (V) 8
(1) VR = VRmax; maximum values. (2) VR = VRmax; typical values.
f = 1 MHz; Tj = 25 C.
Fig.5
Reverse current as a function of junction temperature.
Fig.6
Diode capacitance as a function of reverse voltage; typical values.
handbook, halfpage
300
MBG445
VR (V) 200
(1)
(2)
100
(3)
0 0 100 Tamb (oC) 200
(1) BAS21. (2) BAS20. (3) BAS19.
Fig.7
Maximum permissible continuous reverse voltage as a function of the ambient temperature.
2003 Mar 20
6
NXP Semiconductors
Product data sheet
General purpose diodes
BAS19; BAS20; BAS21
handbook, full pagewidth
tr D.U.T. 10% SAMPLING OSCILLOSCOPE R i = 50 VR 90%
tp t
RS = 50 V = VR I F x R S
IF
IF
t rr t
(1)
MGA881
input signal
output signal
(1) IR = 3 mA.
Fig.8 Reverse recovery voltage test circuit and waveforms.
2003 Mar 20
7
NXP Semiconductors
Product data sheet
General purpose diodes
PACKAGE OUTLINE
BAS19; BAS20; BAS21
Plastic surface mounted package; 3 leads
SOT23
D
B
E
A
X
HE
vMA
3
Q A A1
1
e1 e bp
2
wMB detail X Lp
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 max. 0.1 bp 0.48 0.38 c 0.15 0.09 D 3.0 2.8 E 1.4 1.2 e 1.9 e1 0.95 HE 2.5 2.1 Lp 0.45 0.15 Q 0.55 0.45 v 0.2 w 0.1
OUTLINE VERSION SOT23
REFERENCES IEC JEDEC TO-236AB EIAJ
EUROPEAN PROJECTION
ISSUE DATE 97-02-28 99-09-13
2003 Mar 20
8
NXP Semiconductors
Product data sheet
General purpose diodes
DATA SHEET STATUS DOCUMENT STATUS(1) Objective data sheet Preliminary data sheet Product data sheet Notes PRODUCT STATUS(2) Development Qualification Production
BAS19; BAS20; BAS21
DEFINITION This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
2003 Mar 20
9
NXP Semiconductors
Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers.
Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com
(c) NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands 613514/04/pp10 Date of release: 2003 Mar 20 Document order number: 9397 750 10961

▲Up To Search▲

Price & Availability of BAS21

	To Download BAS21 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .